SA8295PS Automotive Development Platform with Thermal Enclosure Configuration (ADP-8295PS-IVI-T) - LANTRONIX CANADA, ULC

SA8295PS Automotive Development Platform with Thermal Enclosure - Safety Fuse Blown Configuration



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All ADP orders are subject to Qualcomm approval.
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The SA8295PS Snapdragon™ Automotive Development Platform (ADP) based on the Qualcomm® Snapdragon™ Automotive chipset from Qualcomm® Technologies, Inc. (QTI) provides OEMs and ecosystem partners with access to QTI’s high-performance automotive infotainment platform.

This version of the ADP features the QAM8295PS. QAM8925PS, which has a Safety fuse blown, is the next generation Qualcomm® Snapdragon™ automotive infotainment module designed for superior performance and power efficiency. It has been developed as an SEooC (safety element out of context) targeting assumed ASIL B use cases.

SA8295PS includes the following key components: Qualcomm® Kryo™ 695 CPU built on Arm v8 Cortex technology, Qualcomm® Adreno™ 695 GPU, Dual Qualcomm® Hexagon™ Tensor Processors, Qualcomm Spectra™ ISP 395, Adreno 665 VPU, Adreno DPU 1199, and dedicated Safety manager subsystem.

This product includes the thermal ADP AIR mechanical deisgn intended to operate up to 85°C.

1000BASE-T Ethernet PHY (U10) and port (J3) are not populated.

    Optional accessory: SA8295P ADP GMSL2 AR0231 Camera Accessory with Quad HFM Cable