SA8295P Automotive Development Platform with Thermal Enclosure - Standard Configuration

All ADP orders are subject to Qualcomm approval.
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The SA8295P Snapdragon™ Automotive Development Platform (ADP) based on the Qualcomm® Snapdragon™ Automotive chipset from Qualcomm® Technologies, Inc. (QTI) provides OEMs and ecosystem partners with access to QTI’s high-performance automotive infotainment platform.

This version of the ADP features the top tier QAM8295P. QAM8295P is the next generation Qualcomm® Snapdragon™ automotive infotainment module designed for superior performance and power efficiency. It has been developed as an SEooC (safety element out of context) targeting assumed ASIL B use cases.

SA8295P includes the following key components: Qualcomm® Kryo™ 695 CPU built on Arm v8 Cortex technology, Qualcomm® Adreno™ 695 GPU, Dual Qualcomm® Hexagon™ Tensor Processors, Qualcomm Spectra™ ISP 395, Adreno 665 VPU, Adreno DPU 1199, and dedicated Safety manager subsystem.

This product is available in two configurations:

1. SA8295P Automotive Development Platform (non-thermal ADP AIR mechanical design is intended to operate at 25°C or similar ambient lab temperature)
2. SA8295P Automotive Development Platform with Thermal Enclosure (thermal ADP AIR mechanical design is intended to operate up to 85°C)

1000BASE-T Ethernet PHY (U10) and port (J3) are not populated.